Accessory - Die Brush & Foam Pad For Wafer Thin Dies - Sizzix

[SIZ660513]

$12.09
$9.45USD
  • Accessory - Die Brush & Foam Pad For Wafer Thin Dies - Sizzix
  • Accessory - Die Brush & Foam Pad For Wafer Thin Dies - Sizzix-1
(Accessory - Die Brush & Foam Pad For Wafer Thin Dies - Sizzix)

When it comes to removing excess paper in all brands of wafer-thin, chemically-etched dies, the Sizzix Die Brush does it easily and ergonomically. With a sleek, ergonomic rubber-grip handle for non-slippage and easy maneuverability, the Die Brush easily rolls away excess paper to reveal the perfect cut! The Die Brush includes a Foam Pad that acts as the perfect work surface for removing excess paper from the dies and even the cutout.

  • Sizzix Accessory - Die Brush & Foam Pad for Wafer Thin Dies
  • Die Brush measures approx 5 1/2" x 1 3/4" x 1 1/4"
  • Foam Pad measures approx 4 1/2" x 7 1/4"
  • Die Brush easily rolls away excess paper
  • Comfortable ergonomic rubber-grip handle
  • Sizzix Accessory - Die Brush & Foam Pad for Wafer Thin Dies

sizzix, vagabond machine, tim holtz, scrapbooking, card making, paper art

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